| PART |
Description |
Maker |
| GL527 |
(GL527 - GL538) 5MM RESIN MOLD TYPE INFRARED LIGHT EMITTING DIODE
|
Sharp Electrionic Components
|
| GL360 |
3.2mm RESIN MOLD Type Infrared Light Emltting Diode 3.2毫米树脂模具型红外光Emltting二极
From old datasheet system
|
Sharp, Corp.
Sharp Corporation
SHARP[Sharp Electrionic Components]
|
| GL561 GL560 |
Low Peak Forward Voltage Type Φ 5 Resin Mold Package Infrared Emitting Diodes
Low Peak Forward Voltage Type フ 5 Resin Mold Package Infrared Emitting Diodes
Low Peak Forward Voltage Type 5 Resin Mold Package Infrared Emitting Diodes
Low Peak Forward Voltage Type 5 Resin Mold Package Infrared Emitting Diodes
|
SHARP[Sharp Electrionic Components]
Sharp Corporation
|
| ENC499 |
Electrode Notching and Cutting Machine
|
Kemet Corporation
|
| CUTFOX-16-VDE-DB |
VDE-tested cutting tools made from special high-grade tool steel
|
PHOENIX CONTACT
|
| CUTFOX-25-VDE-DB |
VDE-tested cutting tools made from special high-grade tool steel
|
PHOENIX CONTACT
|
| CM501 |
The CM501 block saw is designed for durability and high performance for onsite wet and dry cutting
|
List of Unclassifed Man...
|
| P11976EJ2V0AN00 |
uPC2711-15. uPC2745-49. uPC2791/92. uPC3210 6-Pin Mini-Mold. 6-Pin Super Mini-Mold Silicon High-Frequency Wideband Amplifier MMIC uPC2711 - 15uPC2745 - 49uPC2791/92uPC3210 6引脚小型模具6引脚超小型模具硅高频宽带放大器单
|
Richtek Technology, Corp.
|
| 7525 TOSGAGE-7525 |
X-ray Thickness Gage
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| L9181-02-15 |
130 kV MICROFOCUS X-RAY SOURCE
|
Hamamatsu Corporation
|
| S8559 |
Si photodiode Detector for X-ray monitor
|
Hamamatsu Corporation
|
| L6622-01 |
130 KV MICROFOCUS X-RAY SOURCE
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
